ROHM Strengthens Supply Capability for GaN Power Devices

Executive Summary

• ROHM Co., Ltd. announced a license agreement to integrate TSMC’s GaN process technology into its own development and manufacturing platform, creating an end‑to‑end production system within the ROHM Group.
• The technology transfer targets a 2027 production rollout to satisfy rising demand for GaN power devices in AI servers and electric‑vehicle applications.
• Upon completion of the transfer, the existing automotive GaN partnership between ROHM and TSMC will be amicably concluded, while broader collaboration on efficient power‑supply solutions will continue.

Key Details

• License Agreement: ROHM will license TSMC’s 650 V GaN process technology; the process will be transferred to ROHM Hamamatsu facilities.
• Production Timeline: ROHM aims to have the integrated production system operational in 2027.
• Market Focus: Expanded supply capability for high‑voltage, high‑frequency GaN power devices used in AI server power units and on‑board EV chargers.
• Historical Context:
• ROHM established mass production of 150 V GaN devices in March 2022 (ROHM Hamamatsu).
• Adopted TSMC’s 650 V GaN process since 2023.
• Entered an automotive GaN partnership with TSMC in December 2024.
• Future Collaboration: After the technology transfer, ROHM and TSMC will end the specific automotive GaN partnership but will maintain joint efforts to improve efficiency and compactness of power‑supply systems.
• Strategic Impact: The integration is expected to strengthen ROHM’s supply chain resilience and position it to capture growing demand for GaN devices across AI and EV markets.

Notable Quotes

(No direct quotes were provided in the release.)