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ROHM launches New Top-Side Cooling Package for SiC MOSFETs

ROHM expands its EcoSiC portfolio with a new top-side cooling package targeting high-power xEV and AI server applications.

By The Northwire Desk — AI Analysis Jun 09, 2026 · 16:00 6963 NaN

Executive Summary

ROHM Semiconductor announced the development and mass production start (June 2026) of the TSC3PAK package for SiC MOSFETs.
The package is engineered for automated surface-mount assembly while delivering thermal dissipation comparable to traditional through-hole TO-247-4L packages.
It integrates ROHM’s 4th Generation SiC MOSFETs and features a proprietary groove structure achieving a 6.66mm creepage distance, safely supporting AC peak voltages of 1200V in Pollution Degree 2 environments.
Target applications include xEV onboard chargers, electric compressors, industrial power conversion systems, PV inverters, and high-performance server power supplies.
Simulation models are available on ROHM’s website to support rapid circuit design evaluation.

Material Impact

The release represents a standard product roadmap update rather than a market-moving event. It addresses a known manufacturing bottleneck (transitioning from through-hole to surface-mount for high-power SiC) without disclosing new customer commitments, order volumes, or pricing changes.
Thermal and assembly improvements are incremental but valuable for OEMs seeking to reduce mounting costs and improve production yield in high-power conversion systems.
No financial metrics, margin impacts, or revenue guidance are attached to this announcement. The immediate financial impact on consolidated results is expected to be negligible.
The announcement aligns with broader industry trends toward SiC adoption in EVs and data center power infrastructure, but does not alter ROHM’s competitive positioning or market share in a material way.

6963 · Price

Company Overview

ROHM Semiconductor is a Japanese power electronics and semiconductor manufacturer focused on analog ICs, power devices (silicon, SiC, GaN), sensors, and passive components.
The company operates a vertically integrated manufacturing model, controlling wafer fabrication, processing, packaging, and quality control.
Key end markets include automotive (ADAS, powertrains, body control), industrial equipment, consumer electronics, and AI/data center infrastructure.
Product branding includes EcoSiC, EcoGaN, EcoMOS, and various sensor and IC series, emphasizing efficiency, miniaturization, and automotive-grade reliability.

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