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ROHM launches New Top-Side Cooling Package for SiC MOSFETs

ROHM expands its EcoSiC portfolio with a new top-side cooling package targeting high-power xEV and AI server applications.

By The Northwire Desk — AI Analysis Jun 09, 2026 · 16:00 6963 NaN
Executive Summary
  • ROHM Semiconductor announced the development and mass production start (June 2026) of the TSC3PAK package for SiC MOSFETs.
  • The package is engineered for automated surface-mount assembly while delivering thermal dissipation comparable to traditional through-hole TO-247-4L packages.
  • It integrates ROHM’s 4th Generation SiC MOSFETs and features a proprietary groove structure achieving a 6.66mm creepage distance, safely supporting AC peak voltages of 1200V in Pollution Degree 2 environments.
  • Target applications include xEV onboard chargers, electric compressors, industrial power conversion systems, PV inverters, and high-performance server power supplies.
  • Simulation models are available on ROHM’s website to support rapid circuit design evaluation.
Material Impact
  • The release represents a standard product roadmap update rather than a market-moving event. It addresses a known manufacturing bottleneck (transitioning from through-hole to surface-mount for high-power SiC) without disclosing new customer commitments, order volumes, or pricing changes.
  • Thermal and assembly improvements are incremental but valuable for OEMs seeking to reduce mounting costs and improve production yield in high-power conversion systems.
  • No financial metrics, margin impacts, or revenue guidance are attached to this announcement. The immediate financial impact on consolidated results is expected to be negligible.
  • The announcement aligns with broader industry trends toward SiC adoption in EVs and data center power infrastructure, but does not alter ROHM’s competitive positioning or market share in a material way.
6963 · Price
Company Overview
  • ROHM Semiconductor is a Japanese power electronics and semiconductor manufacturer focused on analog ICs, power devices (silicon, SiC, GaN), sensors, and passive components.
  • The company operates a vertically integrated manufacturing model, controlling wafer fabrication, processing, packaging, and quality control.
  • Key end markets include automotive (ADAS, powertrains, body control), industrial equipment, consumer electronics, and AI/data center infrastructure.
  • Product branding includes EcoSiC, EcoGaN, EcoMOS, and various sensor and IC series, emphasizing efficiency, miniaturization, and automotive-grade reliability.
Read the original news release →

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