Northwire Canada EditionTuesday, August 25, 2026
Sign inSubscribe
Northwire
⌕
GOLD 4715.80 +0.4% SILVER 68.97 +0.6% COPPER 6.71 +1.6% OIL 82.00 −3.5% PALLADIUM 1337.25 −1.9% OTMC 0.485 +9.0% OPW 0.125 +0.0% HI 0.170 +13.3% VCU 1.33 +1.5% DLTA 0.175 −5.4% EMO 0.400 −1.2% GR 0.070 +0.0% MGG 0.400 +2.6% EVI 0.520 −5.5% AVL 9.65 +20.5% VCG 1.50 +9.5% TTS 2.41 −7.3% SCMI 1.88 +1.4% RIO 3.63 +6.5% PUMA 0.120 −7.7% TRR 0.340 −5.6% GOLD 4715.80 +0.4% SILVER 68.97 +0.6% COPPER 6.71 +1.6% OIL 82.00 −3.5% PALLADIUM 1337.25 −1.9% OTMC 0.485 +9.0% OPW 0.125 +0.0% HI 0.170 +13.3% VCU 1.33 +1.5% DLTA 0.175 −5.4% EMO 0.400 −1.2% GR 0.070 +0.0% MGG 0.400 +2.6% EVI 0.520 −5.5% AVL 9.65 +20.5% VCG 1.50 +9.5% TTS 2.41 −7.3% SCMI 1.88 +1.4% RIO 3.63 +6.5% PUMA 0.120 −7.7% TRR 0.340 −5.6%
Other Routine +

ROHM launches New Top-Side Cooling Package for SiC MOSFETs

ROHM expands its EcoSiC portfolio with a new top-side cooling package targeting high-power xEV and AI server applications.

By The Northwire Desk — AI Analysis Jun 09, 2026 · 16:00 6963 NaN
Executive Summary
  • ROHM Semiconductor announced the development and mass production start (June 2026) of the TSC3PAK package for SiC MOSFETs.
  • The package is engineered for automated surface-mount assembly while delivering thermal dissipation comparable to traditional through-hole TO-247-4L packages.
  • It integrates ROHM’s 4th Generation SiC MOSFETs and features a proprietary groove structure achieving a 6.66mm creepage distance, safely supporting AC peak voltages of 1200V in Pollution Degree 2 environments.
  • Target applications include xEV onboard chargers, electric compressors, industrial power conversion systems, PV inverters, and high-performance server power supplies.
  • Simulation models are available on ROHM’s website to support rapid circuit design evaluation.
Material Impact
  • The release represents a standard product roadmap update rather than a market-moving event. It addresses a known manufacturing bottleneck (transitioning from through-hole to surface-mount for high-power SiC) without disclosing new customer commitments, order volumes, or pricing changes.
  • Thermal and assembly improvements are incremental but valuable for OEMs seeking to reduce mounting costs and improve production yield in high-power conversion systems.
  • No financial metrics, margin impacts, or revenue guidance are attached to this announcement. The immediate financial impact on consolidated results is expected to be negligible.
  • The announcement aligns with broader industry trends toward SiC adoption in EVs and data center power infrastructure, but does not alter ROHM’s competitive positioning or market share in a material way.
6963 · Price
Company Overview
  • ROHM Semiconductor is a Japanese power electronics and semiconductor manufacturer focused on analog ICs, power devices (silicon, SiC, GaN), sensors, and passive components.
  • The company operates a vertically integrated manufacturing model, controlling wafer fabrication, processing, packaging, and quality control.
  • Key end markets include automotive (ADAS, powertrains, body control), industrial equipment, consumer electronics, and AI/data center infrastructure.
  • Product branding includes EcoSiC, EcoGaN, EcoMOS, and various sensor and IC series, emphasizing efficiency, miniaturization, and automotive-grade reliability.
Read the original news release →

More from NaN

Jun 17, 2026 · 16:00

ROHM Advances 48V Automotive Power Architecture with Incremental MOSFET Rollout

Other Jun 03, 2026 · 16:00

ROHM Taps AI Server Power Surge as SiC Adoption Accelerates in HVDC Architectures

Other May 28, 2026 · 16:00

Product Ecosystem Expansion

Production / Operations May 21, 2026 · 16:30

ROHM Expands High-Speed Interface Protection Portfolio Amid AI and Auto Demand

Other May 19, 2026 · 17:00

ROHM Expands Automotive Power Portfolio with Incremental Product Launches

Other Apr 28, 2026 · 12:37

Not Provided in Input Data

Other