Volt Carbon Technologies Announces $250,000 Non-Brokered Private Placement and Notice of Annual General Meeting

Executive Summary

• Volt Carbon Technologies Inc. announced a non‑brokered private placement of up to 10 million units at C$0.025 per unit, targeting gross proceeds of up to C$250,000.
• Each unit consists of one common share and one warrant to purchase an additional share at C$0.05 for 24 months.
• Proceeds will be used to fund intellectual‑property development, advance battery and mobile mineral‑separation technologies, and provide general working capital; closing is expected within ~30 business days pending customary conditions and TSX Venture Exchange approval.

Key Details

• Offering Size: Up to 10,000,000 units
• Unit Price: C$0.025 per unit (gross proceeds up to C$250,000)
• Composition of Each Unit:
• 1 common share of Volt Carbon Technologies Inc.
• 1 common share purchase warrant (“Warrant”) granting the holder the right to buy one additional common share at an exercise price of C$0.05 per share.
• Warrant Terms: Exercise price C$0.05; exercisable for 24 months from issuance.
• No Finders’ Fees/Commissions: The company does not anticipate any finder’s fees, commissions, agent options, or other compensation related to the offering.
• Statutory Hold Period: All securities issued will be subject to a four‑month and one‑day statutory hold period under applicable securities legislation.
• Use of Proceeds:
• Support intellectual property development initiatives.
• Advance battery technology projects.
• Develop mobile mineral separation technologies.
• General working capital.
• Closing Conditions: Subject to customary conditions, regulatory approvals (including TSX Venture Exchange approval), and anticipated within approximately 30 business days.
• Insider Participation: No insiders intend to participate; no new control persons will be created.
• Annual General Meeting Notice: AGM scheduled for June 19 2026 at the Royal Colwood Golf Club, Victoria, BC (included as ancillary information).

Notable Quotes

• “We are pleased to announce this financing which will enable us to accelerate our IP development and technology advancement programs,” – V‑Bond Lee, CEO, President, Chairman of the Board.