ROHM's New Compact, Highly Reliable Package Added to Automotive 40V/60V MOSFET Lineup

Executive Summary

• ROHM Semiconductor announced the expansion of its low‑voltage automotive MOSFET lineup with new devices using the HPLF5060 package (4.9 mm × 6.0 mm).
• The HPLF5060 package offers a smaller footprint than the common TO‑252, improved board‑mount reliability via gull‑wing leads, and high‑current capability through copper‑clip junction technology.
• Mass production of the HPLF5060‑based products began in November 2025; online sales are now available, and additional packages (DFN3333 and a forthcoming TOLG package) will enter production in early 2026.

Key Details

• New Package: HPLF5060 (4.9 mm × 6.0 mm) – smaller than TO‑252 (6.6 mm × 10.0 mm), gull‑wing leads, copper‑clip junction for high current.
• Production Start: Mass production of HPLF5060‑based MOSFETs began November 2025.
• Availability: Products are sold online through distributors such as DigiKey and Farnell.
• Upcoming Packages:
• DFN3333 (3.3 mm × 3.3 mm) with wettable flank technology – production slated for February 2026.
• TOLG (TO‑Leaded with Gull‑wing) package (9.9 mm × 11.7 mm) – development underway to further broaden high‑power, high‑reliability options.
• Target Applications: Main inverter control circuits, electric pumps, LED headlights, and other automotive low‑voltage systems.
• Branding: Products are marketed under the EcoMOS™ brand, ROHM’s line of silicon power MOSFETs for energy‑efficient applications across home appliances, industrial equipment, and automotive systems.

Notable Quotes

(No direct quotes were provided in the release.)