ROHM has Introduced Reference Designs for Three-Phase Inverters Featuring New SiC Power Modules

Executive Summary

• ROHM Semiconductor released three new reference designs (REF68005, REF68006, REF68004) for three‑phase inverter circuits using its EcoSiC™ SiC molded modules HSDIP20, DOT‑247, and TRCDRIVE pack™.
• The designs support output power up to the 300 kW class, targeting automotive and industrial applications and aim to reduce engineering effort and person‑hours for device evaluation.
• All three SiC modules are now available for purchase through online distributors (e.g., DigiKey, Farnell), with additional simulation, thermal design, and LTspice® support provided via ROHM’s website.

Key Details

• Reference Designs: REF68005, REF68006, REF68004 – publicly downloadable data enabling designers to create drive circuit boards for three‑phase inverters.
• SiC Modules Covered:
• HSDIP20 – high‑density SiC module; reference design and LTspice® model available.
• DOT‑247 – 2‑in‑1 SiC molded module; reference design and simulation support provided.
• TRCDRIVE pack™ – compact 2‑in‑1 SiC module for xEV inverters; reference design released.
• Power Capability: Designs accommodate output power levels up to the 300 kW class, facilitating adoption across a wide range of high‑power conversion applications.
• Availability: All three modules can be purchased online through distributors such as DigiKey and Farnell; quantities for evaluation kits are limited.
• Support Resources:
• ROHM Solution Simulator – system‑level verification tool accessible on the company website.
• LTspice® circuit models for HSDIP20 and DOT‑247.
• Simulation, thermal design assistance, and downloadable design data provided to accelerate evaluation.
• Additional Offerings: Links to other reference designs and application evaluation kits are available on ROHM’s site, expanding the portfolio of tools that reduce design effort.

Notable Quotes

(No direct quotes were included in the release.)