ROHM Launches SiC MOSFETs in TOLL Package: Achieving Both Miniaturization and High-Power Capability

Executive Summary

• ROHM Semiconductor announced the start of mass production for its SCT40xxDLL series of SiC MOSFETs in TOLL (TO‑Leadless) packages.
• The new TOLL packages deliver ~39 % better thermal performance and a 26 % reduction in footprint versus conventional TO‑263‑7L packages, with a low profile thickness of 2.3 mm.
• Six models are now available (R_DS(on) 13 mΩ–65 mΩ, voltage rating up to 750 V) and can be purchased through major distributors (DigiKey, Mouser, Farnell).

Key Details

• Mass Production Start: September 2025.
• Thermal Improvement: Approximately 39 % better than conventional TO‑263‑7L packages with equivalent voltage ratings and on‑resistance.
• Size Reduction: Component footprint reduced by ~26 %; package thickness 2.3 mm (≈½ the thickness of standard packaged products).
• Voltage Rating: Supports up to 750 V (vs. typical 650 V limit for most TOLL packages).
• On‑Resistance Range: 13 mΩ to 65 mΩ across six model variants.
• Target Applications: Industrial equipment (AI server power supplies, data‑center PFC circuits, PV inverters, energy storage systems) and consumer power supplies requiring high power density in a compact form factor.
• Distribution Channels: Available for online purchase via DigiKey, Mouser, Farnell.
• Design Support: Simulation models for all six products are provided on ROHM’s website to aid rapid circuit design evaluation.
• Branding: Part of the EcoSiC™ brand, emphasizing silicon‑carbide technology advantages over silicon.

Notable Quotes

(No direct quotes were included in the release.)