Celestica unveils 1.6TbE switches for AI data centres

Executive Summary

• Celestica introduced two new 1.6 TbE data‑center switches (DS6000 and DS6001) built on Broadcom’s Tomahawk 6 chipset, delivering up to 102.4 Tbps switching capacity.
• The DS6000 is a 3RU, 64‑port air‑cooled switch; the DS6001 is a 2U hybrid‑cooled model for OCP ORv3 racks, both supporting AI/ML workloads and open‑source NOS (SONiC).
• Switches will be showcased at the OCP Global Summit 2025 in San Jose and listed on the OCP Marketplace with OCP Inspired recognition.

Key Details

• Switch Models: DS6000 (3RU, 64 × 1.6 TbE OSFP ports, air‑cooled) and DS6001 (2U, 64 × 1.6 TbE OSFP ports, hybrid air/liquid cooling).
• Chipset: Broadcom Tomahawk 6 (TH6), providing up to 102.4 Tbps total capacity and 224 Gbit/s SerDes lanes.
• Performance Gains: Double the capacity of Celestia’s existing 800 GbE portfolio.
• Port Speed Flexibility: Supports 50/100/200/400/800 GbE port speeds on each OSFP module.
• Reliability Features: Redundant, field‑replaceable fans; hot‑swappable power supplies; forward/reverse airflow options.
• Cooling Options: DS6000 – traditional air cooling; DS6001 – hybrid cooling for 21‑inch OCP ORv3 racks, optimizing energy efficiency.
• Software Stack: Open‑source network operating system (NOS) via Celestia Solutions for SONiC and other SONiC distributions.
• Marketplace & Community: Specification to be contributed to the Open Compute Project (OCP) community; listed on OCP Marketplace with OCP Inspired recognition.
• Showcase Event: Displayed at OCP Global Summit 2025, San Jose, CA, Oct 13‑16, Booth B2.

Notable Quotes

• “The introduction of our new 1.6 TbE switches marks a significant milestone for Celestica… doubling the switching capacity of our current offerings and designed specifically to meet the demands of AI/ML cluster applications.” – Gavin Cato, SVP & GM, Portfolio Solutions and AI Platform Engineering, Celestica.
• “Tomahawk 6 delivers incredible switching capacity… built to power the next generation of massive AI clusters.” – Ram Velaga, SVP & GM, Core Switching Group, Broadcom.
• “Celestica’s new DS6000 and hybrid‑cooled DS6001 switches showcase the innovation possible when we collaborate…” – Sameh Boujelbene, VP Research, Dell’Oro Group.