Celestica Introduces New Family of 1.6TbE Data Center Switches to Power AI/ML Clusters

Executive Summary

• Celestica introduced two new 1.6 TbE data‑center switches, the DS6000 and DS6001, doubling capacity versus its existing 800 G solutions.
• Both models leverage Broadcom’s Tomahawk 6 chipset delivering up to 102.4 Tbps switching capacity and are targeted at high‑bandwidth AI/ML workloads.
• The switches will be showcased at the OCP Global Summit 2025 and Celestica plans to contribute the specifications to the Open Compute Project (OCP) community and list them on the OCP Marketplace.

Key Details

• Products Launched:
• DS6000 – 3RU, 64‑port × 1.6 TbE, air‑cooled design.

• DS6001 – 2U, 64‑port × 1.6 TbE, hybrid‑cooled (air + liquid) for OCP ORv3 rack.

• Technical Highlights:

• Built on Broadcom Tomahawk 6 (TH6) chipset; 224 GSerDes lanes delivering 102.4 Tbps total capacity.
• Supports 50/100/200/400/800 GbE port speeds; OSFP 1.6 TbE ports.
• Redundant, field‑replaceable fans and hot‑swappable power supplies (DS6000).

• Flexible airflow configurations (forward/reverse) for DS6000.

• Cooling Architecture:

• DS6000 – traditional air‑cooled data‑center installation.

• DS6001 – hybrid cooling, fits 21‑inch OCP ORv3 rack, optimized energy efficiency.

• Software & Ecosystem:

• Open‑source Network Operating System (NOS) support via Celestica Solutions for SONiC and other distributions.

• Market Positioning:

• Represents a “new era” in high‑performance networking for AI/ML clusters, doubling capacity over existing 800 G portfolio.

• Upcoming Exposure:

• Both switches will be displayed at OCP Global Summit 2025 (San Jose, CA, Oct 13‑16) – booth B2.

Notable Quotes

• “The introduction of our new 1.6T switches marks a significant milestone for Celestica… designed specifically to meet the demands of AI/ML cluster applications.” – Gavin Cato, SVP & GM Portfolio Solutions & AI Platform Engineering, Celestica
• “Tomahawk 6 delivers incredible switching capacity… built to power the next generation of massive AI clusters.” – Ram Velaga, SVP & GM, Core Switching Group, Broadcom
• “Celestica continues to be at the forefront of addressing the future needs of AI networking.” – Sameh Boujelbene, VP Research, Dell’Oro Group

Materiality Assessment: Material – Positive (new high‑performance product line with significant revenue and market impact potential).