Hydrograph graphene shows microelectronic cooling

Executive Summary

• Hydrograph Clean Power Inc. announced the results of a peer-reviewed study published in Graphene and 2D Materials (Springer), demonstrating that its oxygenated graphene ink significantly enhances thermal management in microelectronics.
• The study confirms that graphene aerogel ink coatings can increase the heat transfer coefficient of copper by 152% and improve Critical Heat Flux (CHF) by 40%, offering a scalable solution for high-powered devices.
• The technology addresses the growing thermal challenges in semiconductors, electric vehicles, and data centers, positioning Hydrograph’s graphene as a cost-effective alternative to traditional copper and aluminum heat sinks.

Key Details

• Heat Transfer Enhancement: The graphene coatings achieved over 1.5 times the heat transfer capability of bare copper.
• Critical Heat Flux (CHF): The coatings demonstrated a 40% increase in CHF compared to bare copper.
• Bubble Dynamics: The engineered surface texture of the graphene coatings resulted in a 62% enhancement in bubble growth over bare copper, accelerating cooling through bubble formation and evaporation.
• Testing Methodology: Three graphene-based coatings were tested on copper substrates:
  • Two aerosol graphene inks synthesized using a one-step, gas-phase detonation procedure.
  • One coating made using liquid-phase, ultrasonic exfoliation.
• Manufacturing Process: The coatings are applied via a scalable aerosol process, providing a sinter-free, manufacturable solution.
• Market Context: The global market for thermal management materials in microelectronics was valued at $7.21 billion in 2024 and is projected to reach $12.6 billion by 2033.
• Application Areas: High-powered microelectronics, computers, electric vehicles, data centers, aerospace, and other solid-state applications.

Notable Quotes

• "The study highlights the potential of graphene in developing new compounds for next-generation electronics cooling... By pushing the boundaries of conventional conductivity cooling, Hydrograph is positioned to deliver new scalable and sustainable heat management solutions that improve the efficiency and extend the useful life of electronic devices." — Ranjith Divigalpitiya, Chief Science Officer, Hydrograph Clean Power Inc.