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Advantest and Tokyo Seimitsu Announce Joint Development of Die-Level Prober

By The Northwire Desk — AI Analysis Dec 16, 2025 · 03:05 6857 · None None
6857 · Price

Executive Summary

  • Advantest Corporation and Tokyo Seimitsu announced a joint development program for a new die‑level prober aimed at testing high‑performance computing (HPC) and AI semiconductor devices.
  • The collaboration leverages Advantest’s test equipment expertise and Tokyo Seimitsu’s precision positioning technology to address thermal‑control challenges in 2.5D/3D packaged GPUs and CPUs.
  • Both companies expect the new probing solution to strengthen their market positions in the rapidly growing AI/HPC testing segment.

Key Details

  • Partnership Scope: Co‑development of a die‑level prober for AI and HPC device testing, focusing on advanced 2.5D/3D packaging technologies.
  • Technical Focus: Enhancing temperature control during test, improving precision positioning, and integrating next‑generation probing and handling capabilities.
  • Market Rationale: Growing demand for high‑performance semiconductor testing driven by AI model training, inference, and server‑grade computing workloads.
  • Leadership Quotes:
  • Ryuichi Kimura (President & CEO, Tokyo Seimitsu) highlighted the collaboration as a means to “reach new heights of innovation” in precision positioning for the AI era.
  • Douglas Lefever (Representative Director & Group CEO, Advantest) emphasized the partnership’s role in delivering “high‑performance, comprehensive test solutions” for future customer needs.
  • Geographic Reach: Both companies are Japan‑based (TSE: 6857 and TSE: 7729) with global customer bases; the prober will be marketed worldwide.
  • Timeline & Next Steps: Development to commence immediately following the announcement, with product rollout plans aligned with upcoming AI/HPC device releases (specific dates not disclosed).

Notable Quotes

“We offer various solutions centered on precision positioning technology… This collaboration will enable us to reach new heights of innovation as we work with Advantest to develop sophisticated die‑level probing solutions that cater to the demands of the AI era.” – Ryuichi Kimura, President & CEO, Tokyo Seimitsu

“Through our collaboration with Tokyo Seimitsu, we will deliver high‑performance, comprehensive test solutions that meet our customers' future needs in areas of die‑level probing.” – Douglas Lefever, Representative Director and Group CEO, Advantest

Read the original news release →

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