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M&A / Property

Sivers Semiconductors, O-Net and Enablence Technologies Announce Collaboration on Co-Packaged Optics

By The Northwire Desk — AI Analysis Mar 17, 2026 · 07:01 ENA · 2.35 Enablence Technologies Inc.
ENA · Price

Executive Summary

  • Enablence Technologies announced a strategic partnership with Sivers Semiconductors AB and O‑Net Technologies to develop an 8‑channel external light source (ELS) module for AI datacenters and high‑performance computing (HPC) systems.
  • O‑Net will act as the OEM, integrating Sivers’ laser arrays with Enablence’s NxN Star Coupler to create a scalable ELS solution.
  • The three companies will showcase the joint solution at the OFC 2026 show in Los Angeles (March 17‑20, 2026).

Key Details

  • Partnership Scope: Development of an 8‑channel external light source (ELS) module targeting AI datacenters and HPC systems.
  • Roles:
  • O‑Net Technologies – OEM partner responsible for integration and manufacturing.
  • Sivers Semiconductors – Supplier of DFB laser arrays.
  • Enablence Technologies – Provider of NxN Star Coupler for wavelength distribution.
  • Product Benefits: Compact, scalable external light source enabling multi‑wavelength optical interconnects for both scale‑out networking and scale‑up compute implementations.
  • Showcase Venue: OFC 2026 (Optical Fiber Communication Conference) in Los Angeles, CA, March 17‑20, 2026. Booth locations: Enablence (4812), Sivers (1250), O‑Net (2039).
  • Executive Comments:
  • Alex McCann (Managing Director, Sivers Photonics) highlighted the importance of external light sources for co‑packaged optics (CPO) architectures.
  • Todd Haugen (CEO, Enablence) referenced a McKinsey forecast that AI infrastructure could exceed $7 trillion by 2030 and stressed accelerated commercialization.
  • Austin Na (CEO & Chairman, O‑Net) expressed enthusiasm for the collaborative ELS module.

Notable Quotes

  • “External light sources are critical to scalable co‑packaged optics… will accelerate deployment of next‑generation AI infrastructure.” – Alex McCann, Sivers Semiconductors
  • “A recent McKinsey report forecasts the AI infrastructure market will surpass $7 trillion by 2030…” – Todd Haugen, Enablence Technologies
  • “Together, we're enabling a practical, scalable ELS aligned with the needs of High‑Performance Compute (HPC) and AI data centers.” – Austin Na, O‑Net Technologies
Read the original news release →

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